I'll also throw in, if you want to do localized reflow without heating the whole board, a heatshrink gun can work (Sparkfun has a Heaterizer 2000 for like $10). $3 on ebay would get you a replacement cap of the right size, and you could solder it back in with a cheap iron. Has anyone tried increasing the number of functional engines of an ASIC which is in place. Capacitor replacement is one of the easier repairs to make. Reflow of BGA Nividia graphics chips on Presario motherboards is a classic case of saving a motherboard with a little skill, heating the solder under the BGA to reflow where opens may have occurred. By the way, your motherboard was not ruined. Since you wanted to reflow a populated board, I would have sought one of those tutorials out (there's lots of them, particularly for the x-box, as reflowing the board is something many customers have needed to do). Some BGA manufacturing are already including this information in their datasheets. Shadow Moire or fringe projection techniques are the right way to measure BGA or other components are warping during reflow. You can not document common sense in the space of a tutorial. Some BGAs types warp a lot during reflow.
![reflow bga reflow bga](https://cdn.instructables.com/ORIG/FJK/6AZX/CLXEP27QQX5/FJK6AZXCLXEP27QQX5.jpg)
The author could not anticipate that someone would try to reflow plastic parts, or inhale the fumes. The author's example is building a BARE PCB up with no mention of plastic. Always seek out more than 1 source of information. Valuable life lesson here if you can forgive yourself for damaging your board. Make the oven warm without being really hot ( 120 F or something like that) and leave them in for a while. Don't open the door all the way or take stuff out until the temp is less than 100F.įinally - if the parts have been lying around, they will have absorbed moisture and must be baked before soldering (or they will popcorn).
REFLOW BGA CRACK
During the cooldown phase, I found opening the oven door just a tiny crack got it just about perfect.
![reflow bga reflow bga](https://cdn.shopify.com/s/files/1/0269/0134/8465/products/m171-5_efdb89e6-194a-4c00-97db-ff9ecc72908d_2048x2048.jpg)
If the rise rate is too fast, put a chunk of scrap metal in the oven. Assembly of BGA and CSP follows a typical surface mount technology (SMT) process: print solder paste, place components, reflow, and inspection. CSP behaves in a similar way to BGA, except for the fact that CSP is more sensitive to mis-handling. It is important to try to follow the rates. The downside of BGA is the difficulty in inspecting the interior solder joints.
REFLOW BGA FULL
The best thing to do (unless you want to make a PID controller) is simply turn the temp full on, then ride the on/off knob to try to match the profile.Īlso - download the temperature profile from the solder manufacturer and try to follow it. One of the other good things is that the sensing element is a tiny bead, so you can put it right next to the parts you are soldering and get really good accuracy.ĭo not attempt to use the temperature control knob on the oven. My Fluke DMM takes a K-type thermocoupld input.
![reflow bga reflow bga](http://www.majelac.com/assets/Uploads/_resampled/ResizedImageWzM0OSwyNDdd/Flip-Chip-Assembly.jpg)
The best thing to use is a thermocouple, which you can plug into a lot of the better multimeters. Do NOT use an oven thermometer!! You would be lucky if they were +/-10 C